Power chips are connected to external circuits with packaging, and their efficiency depends on the assistance of the packaging. In high-power situations, power chips are normally packaged as power modules. Chip interconnection describes the electric link on the top surface area of the chip, which is typically aluminum bonding cable in typical components. ^
Typical power component bundle cross-section

Presently, commercial silicon carbide power modules still mainly make use of the packaging innovation of this wire-bonded traditional silicon IGBT module. They encounter issues such as huge high-frequency parasitic criteria, insufficient warmth dissipation capability, low-temperature resistance, and insufficient insulation toughness, which limit making use of silicon carbide semiconductors. The display screen of outstanding efficiency. In order to fix these issues and totally exploit the substantial prospective advantages of silicon carbide chips, many brand-new product packaging innovations and solutions for silicon carbide power modules have actually emerged over the last few years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually created from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold cords to copper wires, and the driving pressure is price reduction; high-power devices have actually established from light weight aluminum wires (strips) to Cu Clips, and the driving force is to boost product performance. The better the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to connect chips and pins. Compared to standard bonding product packaging methods, Cu Clip innovation has the adhering to benefits:

1. The connection in between the chip and the pins is made of copper sheets, which, to a certain extent, changes the standard cord bonding method in between the chip and the pins. Therefore, a special bundle resistance value, greater present flow, and far better thermal conductivity can be gotten.

2. The lead pin welding location does not require to be silver-plated, which can completely save the expense of silver plating and inadequate silver plating.

3. The item look is completely regular with regular products and is mainly made use of in servers, portable computers, batteries/drives, graphics cards, motors, power supplies, and other fields.

Cu Clip has 2 bonding approaches.

All copper sheet bonding technique

Both eviction pad and the Resource pad are clip-based. This bonding approach is more expensive and complicated, but it can achieve much better Rdson and better thermal effects.

( copper strip)

Copper sheet plus wire bonding technique

The source pad utilizes a Clip technique, and the Gate uses a Cord technique. This bonding technique is somewhat more affordable than the all-copper bonding method, conserving wafer location (appropriate to really little gateway areas). The procedure is less complex than the all-copper bonding approach and can get better Rdson and better thermal effect.

Supplier of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding price of copper per kilo, please feel free to contact us and send an inquiry.

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